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Ni-C silicone shielding strip
Ag-Al silicone shielding strip
Silicone conductive strip
Silicone shielding strip
| Property | Ag/Al | Ag | Ni/C |
|---|---|---|---|
| Volume Resistivity (Ω·cm) | 0.004 | 0.002 | 0.05 |
| Surface Resistance (Ω/inch) | <20 | <20 | <50 |
| Shielding Effectiveness (dB) | 130 | 130 | 110 |
| Shielding Rate | 99.9999% | 99.9999% | 99.999% |
| Tensile Strength (MPa) | 8.9 | 3.5 | 4.1 |
| Tear Strength (N/mm) | 39 | 16 | 15 |
| Elongation at Break (%) | 637 | 200 | 160 |
| Compression Set (100°C/168h) | 9.2% | 9.3% | 9.3% |
| Electrochemical Compatibility | ✅ Excellent (with Al housing) | ✅ Good | ✅ Good (with Al housing) |
| Salt Spray / Corrosion Resistance | ✅ Excellent | ✅ Good | ✅ Excellent |
| Flame Rating | UL94 HB | UL94 HB | UL94 HB |
| Cost | Medium | High | Low (1/4 of Ag series) |
| Test Standards | MIL-G-83528 · ASTM D412 | ||
Volume Resistivity: Lower values = higher conductivity. Ag: 0.002Ω·cm (lowest), Ag/Al: 0.004Ω·cm, Ni/C: 0.05Ω·cm.
Shielding Effectiveness: 130dB = 99.9999% attenuation · 110dB = 99.999% attenuation.
Tensile Strength: Ag/Al highest at 8.9MPa — ideal for demanding mechanical applications.
Electrochemical Compatibility: Ag/Al and Ni/C are compatible with aluminum housings — minimizing galvanic corrosion risk.
Test Standards: All products tested per MIL-G-83528 and ASTM D412. Full test reports available upon request.
| Comparison | Coating (Surface Treatment) | Compounding (Bulk Loading) |
|---|---|---|
| Principle | Conductive layer applied to silicone substrate surface | Conductive fillers blended into silicone matrix before extrusion |
| Conductive Layer Location | Surface only (surface conductive) | Throughout entire cross-section (bulk conductive) |
| Filler Loading | Conductive filler in coating layer only | ~40% filler + ~60% silicone |
| Max Coating / Conductive Thickness | ≤1mm | N/A (entire material is conductive) |
| Volume Resistivity | Higher (depends on coating quality and thickness) | Lower, more stable (uniform filler distribution) |
| Shielding Stability | May degrade with wear or coating delamination | Consistently stable — fillers uniformly distributed |
| Mechanical Properties | Substrate properties dominate (coating may crack) | Uniform performance throughout |
| Shielding Mechanism | Primarily reflection | Primarily absorption |
| Cost | Lower | Higher (more conductive material) |
| Best For | Standard industrial, cost-sensitive applications | Military, medical, 5G, high-end applications |
Volume Resistivity Comparison (Typical Values):
Ag/Al: Coating ~0.008Ω·cm → Compounding ~0.004Ω·cm
Ag: Coating ~0.005Ω·cm → Compounding ~0.002Ω·cm
Ni/C: Coating ~0.08Ω·cm → Compounding ~0.05Ω·cm
Bottom line: Compounding creates a denser, more continuous conductive network throughout the entire material — delivering significantly lower volume resistivity and more stable shielding performance than coating.
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